In a sector that has seen introverted evolution during the past 30 years, electronics manufacturing sees the emergence of Industry 4.0, with issues behind it that makes significant change to the PCB electronics industry inevitable.…
Laser plastic welding is a method of bonding two or more thermoplastic components together and today’s designers and engineers can benefit from understanding transmission laser welding of plastics – particularly surrounding the concept and design…
The latest edition of Sustainable Development Magazine & OnBoard Technology is now available online. Download the latest e-mag version here. In this issue: Industry 4.0: the real implications for manufacturers; Design considerations for laser welding…
There are considerations in electronic assembly design which apply at the development phase for test points to be put in place by designers of printed circuit boards. New test technologies are helping overcome some of…
Emerging European models to retain competitiveness sees Industry 4.0 as Germany’s newest drive to build industrial strength. One of the key principles behind it is flexibility of planning, to be able to quickly adjust production…
Insights into the battle against counterfeit semiconductor products, which is vital to ensuring safety and control in electronics manufacturing. As with every type of product, ranging from jewelry to wine to currency, semiconductor products can…
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them cannot…
There is a strong desire to develop advanced packaging that can meet the growing demand for miniaturization, high-speed performance, and flexibility for handheld, portable, in vivo, and implantable devices. Tampering of electronic components is a…
Automotive electronics manufacturers are facing significant challenges with respect to the thermo-mechanical reliability requirements of solder joints. First, there is the increasing harshness of the operating environment as electronic control modules are placed closer to…
A round-up of industry news from OnBoard Technology´s editorial focus covering high-level assembly design, production technologies and equipment. Subjects of interest include Advanced Materials, SBU, MIDs, Area Array, Flip-Chip, MCMs, HDI, HDP, Leadfree Soldering and more…
