OnBoard Technology

  • Schermata 2013-08-29 a 20.28.05

    Advanced electronic substrates for miniaturized applications

    There is a strong desire to develop advanced packaging that can meet the growing demand for miniaturization, high-speed performance, and flexibility for handheld, portable, in vivo, and implantable devices. Tampering of electronic components is a…

  • Figure 1 – Plotting the effect of single element additions

    Increasing solder reliability at elevated temperatures

    Automotive electronics manufacturers are facing significant challenges with respect to the thermo-mechanical reliability requirements of solder joints. First, there is the increasing harshness of the operating environment as electronic control modules are placed closer to…

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    Electronics Manufacturing News

    A round-up of industry news from OnBoard Technology´s editorial focus covering high-level assembly design, production technologies and equipment. Subjects of interest include Advanced Materials, SBU, MIDs, Area Array, Flip-Chip, MCMs, HDI, HDP, Leadfree Soldering and more…

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    A Multi-channel Media Initiative

    As the most comprehensive multi-channel media initiative dedicated to the electronics manufacturing industry, Sustainable Development and OnBoard Technology provide an integrated editorial platform for your digital and print campaigns surrounding materials, tools and equipment for design,…

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    Archive of Print Editions

    As of 2014, OnBoard Technology, the international magazine dedicated to PCB Design, Manufacturing, Assembly and Test is integrated in Hadrian Media’s multi-channel platform bringing you SUSTAINABLE DEVELOPMENT, the ID Publications and OnBoard Technology. Follow the link…